PCB / PWB
Copper
Electrolytic Copper Plating
ETN
EPL
EVF-UF
EVF-TF
Electroless Copper Plating
PEA Process
PSY Process
PGT Process
Desmear
APPDES Process
DEC-501 / DEC- 801 Process
Pretreatment
ALCUP Process
THRUCUP Process
Final Finish
EL-Sn / Immersion Tin
EL-Sn Process
EL-Ag / Immersion Silver
EN-Ag Process
ENIG / Electroless Nickel Immersion Gold
ENIG Process
ENEPIG / Electroless Nickel Electroless Palladium Immersion Gold
ENEPIG Process
ENAG / Electroless Nickel Auto-catalyst Gold
ENAG Process
DIG / Direct Immersion Gold
DIG Process
Direct Plating
Pd Colioid Type
PDMT Process
Wafer
ENIG
Aluminium Substrate
EPITHAS Process
Copper Substrate
EPITHAS Process
ENEPIG
Aluminium Substrate
EPITHAS Process
Copper Substrate
EPITHAS Process
Decoration
Çöó½ºÆ½ µµ±Ý (Plating on Plastics)
Çöó½ºÆ½ µµ±Ý (Plating on Plastics)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
Àüó¸® (Pretreatment)
Àüó¸® (Pretreatment)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
µ¿µµ±Ý (Copper Plating)
µ¿µµ±Ý (Copper Plating)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
´ÏÄ̵µ±Ý (Nickel Plating)
´ÏÄ̵µ±Ý (Nickel Plating)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
Å©·Òµµ±Ý (Chromium Plating)
Å©·Òµµ±Ý (Chromium Plating)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
¾Æ¿¬µµ±Ý (Zinc Plating)
¾Æ¿¬µµ±Ý (Zinc Plating)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
Å©·Î¸ÞÀÌÆ® ÄÚÆà (Chromate Coating)
Å©·Î¸ÞÀÌÆ® ÄÚÆà (Chromate Coating)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
¼® ¼® ³³(³³¶«)µµ±Ý (Tin Tin Lead(Solder) Plating)
¼®, ¼® ³³(³³¶«)µµ±Ý (Tin, Tin Lead(Solder) Plating)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
¹«ÀüÇØ µµ±Ý (Electroless Plating)
¹«ÀüÇØ µµ±Ý (Electroless Plating)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
¹Ú¸®Á¦ (Stripper)
¹Ú¸®Á¦ (Stripper)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.
°íÇü ¹öÇÁ ¿¬¸¶Á¦ (Solid Buffing Compound)
°íÇü ¹öÇÁ ¿¬¸¶Á¦ (Solid Buffing Compound)
µî·ÏµÈ Á¦Ç°ÀÌ ¾ø½À´Ï´Ù.